On November 9, 2026, from 10:30 AM to 4:30 PM, Dr. Wayne H. Choe, CEO of Tystar Corporation, will present the seminar “Low-Pressure Chemical Vapour Deposition: Fundamentals, Processes and Applications in Micro- and Nanofabrication”.
Low-pressure chemical vapour deposition (LPCVD) is a key technology for producing uniform, reproducible thin films used in microelectronics, microelectromechanical systems (MEMS) and integrated photonics.
Through seven thematic lectures, the seminar will explore the physical and chemical principles of LPCVD and how precursors and process parameters affect the properties of deposited materials. Starting with silicon and silicon nitride deposition, it will cover low-stress nitride for MEMS and stoichiometric nitride for photonics. It will also compare thermal oxidation with LPCVD silicon oxide deposition, with particular attention to the challenges of TEOS-based processes. Each topic will be accompanied by examples of devices and applications.
Agenda
Session I – Fundamentals, silicon and nitride deposition | 10:30 AM–12:30 PM
- Overview of LPCVD processes
- Silicon LPCVD
- Silicon nitride LPCVD
Session II – Advanced applications and oxide processes | 2:00–4:30 PM
- Low-stress silicon nitride for MEMS
- Stoichiometric silicon nitride for photonics
- Oxidation vs. oxide LPCVD
- TEOS oxide LPCVD challenges
The event will take place in the INRiM Library (Building B, ground floor) at the INRiM Campus, Strada delle Cacce 91, Turin.
Participation is possible in two ways:
